The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2014
Filed:
Jun. 12, 2012
Chin-liang Chen, Hsinchu, TW;
Wei-ting Lin, Taipei, TW;
Yu-chih Liu, Taipei, TW;
Kuan-lin Ho, Hsinchu, TW;
Jason Shen, Hsinchu, TW;
Chin-Liang Chen, Hsinchu, TW;
Wei-Ting Lin, Taipei, TW;
Yu-Chih Liu, Taipei, TW;
Kuan-Lin Ho, Hsinchu, TW;
Jason Shen, Hsinchu, TW;
Abstract
A semiconductor package assembly process that includes attaching one or more dies to a substrate; applying an adhesive material on a periphery of the substrate by an adhesive dispenser having a stamp-type dispensing head; applying a thermal interface material (TIM) on a top surface of the die by a TIM dispenser having a stamp-type dispensing head; and positioning a lid over the one or more dies and placing the lid on top of the adhesive material and the TIM by a lid carrier to encapsulate the one or more dies.