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Company Filing History:
Years Active: 2014-2025
Title: Kuan-Lin Ho: Innovating the Future of Semiconductor Packaging
Introduction
Kuan-Lin Ho, a prominent inventor based in Hsinchu, Taiwan, has made a significant mark in the field of semiconductor technology. With an impressive portfolio of 52 patents to his name, he is recognized for his pioneering contributions that enhance the efficiency and effectiveness of semiconductor packaging.
Latest Patents
Among Kuan-Lin Ho's latest innovations are two notable patents focusing on semiconductor packages and structures. The first patent details a groundbreaking semiconductor package and its manufacturing method. This innovation integrates a first and second semiconductor die, which are of different types, enclosed within a molding compound. A crucial feature of this design is the heat dissipation module, which is in direct contact with the semiconductor dies to ensure optimal thermal management. This structure allows for improved performance in semiconductor applications.
The second patent features a sophisticated semiconductor structure that includes a redistribution structure and conductive terminals. This invention presents a topmost pad within a dielectric layer and a bottommost UBM pad that works collaboratively to enhance the connectivity and reliability of semiconductor devices. These advancements showcase Kuan-Lin's commitment to pushing the boundaries of semiconductor technologies.
Career Highlights
Kuan-Lin Ho’s career is marked by his association with Taiwan Semiconductor Manufacturing Company Limited, where he applies his expertise to advance semiconductor fabrication processes. His contributions have established him as an influential figure in the research and development community, highlighting the importance of innovative methodologies in the semiconductor sector.
Collaborations
Throughout his career, Kuan-Lin has collaborated with esteemed colleagues, including Chin-Liang Chen and Chi-Yang Yu. These partnerships are vital as they foster knowledge sharing and stimulate creative solutions to complex technological challenges. Together, they strive to enhance semiconductor capabilities, underscoring the collaborative spirit prevalent in the field of innovation.
Conclusion
Kuan-Lin Ho's extensive portfolio of patents and his continuous efforts at Taiwan Semiconductor Manufacturing Company Limited exemplify the critical role inventors play in the advancement of technology. His latest innovations in semiconductor packaging and structures not only signify personal achievements but also contribute to the broader landscape of semiconductor research and development, paving the way for future breakthroughs in the industry.
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