The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2018
Filed:
Dec. 26, 2013
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Kuan-Lin Ho, Hsin-Chu, TW;
Sheng-Hsiang Chiu, Tainan, TW;
Hsin-Yu Pan, Taipei, TW;
Yu-Chih Liu, Taipei, TW;
Chin-Liang Chen, Kaohsiung, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
Embodiments of a lid covering a device die improving heat dissipation for a die package are described. Trenches are formed on the bottom side of a lid to increase surface area for heat dissipation. Various embodiments of the trenches on the lid are described. The layout and design of the trenches could be optimized to meet the heat dissipation need of the device die(s). By using the lid with trenches, heat dissipation efficiency is improved and the amount of thermal interface material (TIM) could be reduced. In addition, the selection of thermal interface materials for the lid is widened.