Tsung-Shu Lin

This inventor holds 102 USPTO granted patents and 25 published patent applications, primarily in Semiconductor Packaging (CPC class H01L25-50). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., United Microelectronics Corp., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2011-2026.

USPTO Granted Patents = 102 (Patent Applications = 25)

% Patents Active = 95.1

Average Co-Inventor Count = 4.3

ph-index = 8

Forward Citations = 358(Granted Patents)

Forward Citations (Not Self Cited) = 278(Dec 10, 2025)

Inventors with similar research interests:

🔬 See more inventors

Location History:

Taipei County, TW (2011)
Taipei, TW (2019)
Yonghe, TW (2011 - 2023)
New Taipei, TW (2013 - 2024)
Hsinchu, TW (2023 - 2024)

Company Filing History:

98 out of 42,810

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

3 out of 7,269

United Microelectronics Corp.

patents

1 out of 465

Taiwan Semiconductor Manufacturing Co., Ltd.

patents

Years Active: 2011-2026

Loading Chart...

Areas of Expertise:

Integrated Circuit Packages

Heat Spreading Device

UBM/RDL Routing

Semiconductor Package

Heat Dissipation Structure

Manufacturing Method

Stacked Via Structure

Redistribution Structure

Lid Structure

Mechanical Brace Standoffs

Contact Pad

Thermal Enhanced Layers

102 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12708026 - Package structure and method of manufacturing the same (2026-08-11),

2. 12653061 - Package structure and method of manufacturing the same (2026-06-09),

3. 12604734 - Integrated circuit packages and methods (2026-04-14),

4. 12550783 - Device and method for UBM/RDL routing (2026-02-10),

5. 12550729 - Heat spreading device and method (2026-02-10),

6. 12538816 - Package structure having line connected via portions (2026-01-27),

7. 12506087 - Semiconductor package with redistribution structure and manufacturing method thereof (2025-12-23),

8. 12476140 - Semiconductor package including step seal ring and methods forming same (2025-11-18),

9. 12412805 - Semiconductor package (2025-09-09),

10. 12394754 - Device and method for UBM/RDL routing (2025-08-19),

11. 12387988 - Method of manufacturing semiconductor package having lid structure (2025-08-12),

12. 12327819 - Devices employing thermal and mechanical enhanced layers and methods of forming same (2025-06-10),

13. 12322727 - Device and method for UBM/RDL routing (2025-06-03),

14. 12191239 - Stacked via structure disposed on a conductive pillar of a semiconductor die (2025-01-07),

15. 12191224 - Semiconductor package and manufacturing method thereof (2025-01-07),

Title: The Innovative Journey of Tsung-Shu Lin

Introduction: Tsung-Shu Lin, a pioneering inventor hailing from New Taipei, Taiwan, has made significant contributions to the world of technology through his groundbreaking innovations.

Latest Patents: Tsung-Shu Lin's most recent patents include advancements in renewable energy technology, smart home devices, and artificial intelligence systems, showcasing his versatility and forward-thinking approach.

Career Highlights: With a career spanning over two decades, Tsung-Shu Lin has established himself as a leading figure in the tech industry. His work has been recognized globally, earning him prestigious awards and accolades for his inventive solutions.

Collaborations: Throughout his career, Tsung-Shu Lin has collaborated with top research institutions, leading companies, and innovative startups to bring his ideas to life. His ability to work across diverse teams has led to the successful implementation of cutting-edge technologies.

Conclusion: Tsung-Shu Lin's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors. His impact on the tech industry is undeniable, and his legacy will undoubtedly shape the future of technology for years to come.