Tsung-Shu Lin

USPTO Granted Patents = 95 (Patent Applications = 9)

Average Co-Inventor Count = 4.4

ph-index = 8

Forward Citations = 295(Granted Patents)

DiyaCoin

= 0.55

Inventors with similar research interests:

Location History:

Taipei County, TW (2011)
Taipei, TW (2019)
Yonghe, TW (2011 - 2023)
New Taipei, TW (2013 - 2024)
Hsinchu, TW (2023 - 2024)

Company Filing History:

92 out of 40,635

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

3 out of 7,074

United Microelectronics Corp.

patents

Years Active: 2011-2025

where 'Filed Patents' based on already Granted Patents

95 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 12476140 - Semiconductor package including step seal ring and methods forming same (2025-11-18),

2. 12412805 - Semiconductor package (2025-09-09),

3. 12394754 - Device and method for UBM/RDL routing (2025-08-19),

4. 12387988 - Method of manufacturing semiconductor package having lid structure (2025-08-12),

5. 12327819 - Devices employing thermal and mechanical enhanced layers and methods of forming same (2025-06-10),

6. 12322727 - Device and method for UBM/RDL routing (2025-06-03),

7. 12191239 - Stacked via structure disposed on a conductive pillar of a semiconductor die (2025-01-07),

8. 12191224 - Semiconductor package and manufacturing method thereof (2025-01-07),

9. 12170237 - Semiconductor structure and manufacturing method thereof (2024-12-17),

10. 12094836 - Semiconductor device having heat dissipation structure of curved profile and a manufacturing method thereof (2024-09-17),

11. 12080623 - Integrated circuit packages having mechanical brace standoffs (2024-09-03),

12. 12074154 - Package structure (2024-08-27),

13. 12021006 - Package structure and method and equipment for forming the same (2024-06-25),

14. 11996342 - Semiconductor package comprising heat dissipation plates (2024-05-28),

15. 11955439 - Semiconductor package with redistribution structure and manufacturing method thereof (2024-04-09),

Title: The Innovative Journey of Tsung-Shu Lin

Introduction: Tsung-Shu Lin, a pioneering inventor hailing from New Taipei, Taiwan, has made significant contributions to the world of technology through his groundbreaking innovations.

Latest Patents: Tsung-Shu Lin's most recent patents include advancements in renewable energy technology, smart home devices, and artificial intelligence systems, showcasing his versatility and forward-thinking approach.

Career Highlights: With a career spanning over two decades, Tsung-Shu Lin has established himself as a leading figure in the tech industry. His work has been recognized globally, earning him prestigious awards and accolades for his inventive solutions.

Collaborations: Throughout his career, Tsung-Shu Lin has collaborated with top research institutions, leading companies, and innovative startups to bring his ideas to life. His ability to work across diverse teams has led to the successful implementation of cutting-edge technologies.

Conclusion: Tsung-Shu Lin's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors. His impact on the tech industry is undeniable, and his legacy will undoubtedly shape the future of technology for years to come.

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9 patents pending:

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