The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2017
Filed:
May. 02, 2016
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Meng-Tse Chen, Changzhi Township, TW;
Yu-Chih Liu, Taipei, TW;
Hui-Min Huang, Taoyuan, TW;
Wei-Hung Lin, Xinfeng Township, TW;
Jing Ruei Lu, Taipei, TW;
Ming-Da Cheng, Jhubei, TW;
Chung-Shi Liu, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Abstract
A package on package structure providing mechanical strength and warpage control includes a first package component coupled to a second package component by a first set of conductive elements. A first polymer-comprising material is arranged between the first package component and the second package component. The first polymer-comprising material surrounds the first set of conductive elements and the second package component. A third package component is coupled to the second package component by a second set of conductive elements. An underfill is arranged on the second package component and surrounds the second set of conductive elements. The first polymer-comprising material extends past sidewalls of the underfill.