Taoyuan, Taiwan

Hui-Min Huang

This inventor holds 64 USPTO granted patents and 12 published patent applications, primarily in Semiconductor Packaging (CPC class H01L). Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2014-2026.

USPTO Granted Patents = 64 

% Patents Active = 92.2

Average Co-Inventor Count = 6.1

ph-index = 7

Forward Citations = 131(Granted Patents)

Forward Citations (Not Self Cited) = 113(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Taoyuan County, TW (2016 - 2017)
  • Hsin-Chu, TW (2017 - 2018)
  • Taoyuan, TW (2014 - 2024)

Company Filing History:


Years Active: 2014-2026

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Areas of Expertise:
3D Package Structure
Conductive Bumps
Fluxless Bonding
Chip Package
Wafer Etching
Package-on-Package
Stress-Resistant Bonding
Encapsulated Substrate
Molding Structure
Thermal Management
Redistribution Structures
64 patents (USPTO):Explore Patents

Title: Hui-Min Huang: Shaping the Future through Technological Innovation

Introduction:

Hui-Min Huang, a visionary inventor based in Taoyuan, Taiwan, is making significant strides in shaping the future of various industries through his passion for innovation and relentless pursuit of technological advancement. With an impressive portfolio of 54 patents, Hui-Min Huang has established himself as a key player in the global innovation landscape.

Latest Patents:

His latest patents showcase his innovative thinking and technical expertise. One of his patents focuses on packages including multiple encapsulated substrate blocks and overlapping redistribution structures, revolutionizing packaging technology. Another patent highlights a chip structure and method for forming the same, emphasizing his commitment to pushing the boundaries of semiconductor technology.

Career Highlights:

Hui-Min Huang is associated with Taiwan Semiconductor Manufacturing Company Limited (TSMC), a renowned semiconductor foundry. His contributions to TSMC have been instrumental in driving technological advancements and pioneering new solutions in the semiconductor industry. With a keen eye for detail and a knack for problem-solving, he has consistently delivered groundbreaking inventions that have set new benchmarks in the field.

Collaborations:

In his professional journey, Hui-Min Huang has collaborated with esteemed colleagues such as Ming-Da Cheng and Chung-Shi Liu. Together, they have worked on innovative projects, leveraging their collective expertise to develop cutting-edge technologies that have garnered recognition and acclaim in the industry.

Conclusion:

In conclusion, Hui-Min Huang's unwavering dedication to innovation and his exceptional talent for inventing transformative technologies underscore his status as a visionary inventor. His remarkable contributions to the field of technology continue to shape the future of various industries, leaving a lasting impact on the global innovation landscape.

Profile summary based on public USPTO records.
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