The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 30, 2017
Filed:
Jun. 29, 2015
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Yu-Chih Liu, Taipei, TW;
Chien-Kuo Chang, Hsinchu County, TW;
Chi-Yang Yu, Taoyuan County, TW;
Jing Ruei Lu, Taipei, TW;
Chih-Hao Lin, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
An integrated circuit (IC) package includes a first substrate; a second substrate disposed over the first substrate; a plurality of connectors disposed between the first and second substrates such to electrically couple the first and second substrate; a constraint layer disposed over the first and second substrates such that a cavity is formed between the constraint layer and the first substrate; and a molding material disposed within the cavity and extending through the constraint layer. The constraint layer has a top surface and an opposing bottom surface and the molding material extends from the top surface to the bottom surface of the constraint layer.