Jincheol Kim

This inventor holds 15 USPTO granted patents and 19 published patent applications and 6 EPO patents. Top assignee: Absolics Inc.. Active years: 2022-2026.

USPTO Granted Patents = 15 (Patent Applications = 19)

% Patents Active = 93.3

EPO Patents = 6 (Patent Applications = 19)

Average Co-Inventor Count = 3.1

ph-index = 1

Forward Citations = 6(Granted Patents)

Company Filing History:

15 out of 19

Absolics Inc.

patents

Years Active: 2022-2026

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15 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12740443 - Via connection structure comprising multiple vias and substrate comprising the same (2026-09-15),

2. 12672541 - Substrate comprising a lid structure, package substrate comprising the same and semiconductor device (2026-06-30),

3. 12469736 - Substrate carrier and substrate assembly comprising the same (2025-11-11),

4. 12456672 - Packaging substrate having element group in cavity unit and semiconductor device comprising the same (2025-10-28),

5. 12456653 - Packaging substrate and semiconductor device comprising the same (2025-10-28),

6. 12288742 - Packaging substrate and semiconductor apparatus comprising same (2025-04-29),

7. 12198994 - Packaging substrate and method for manufacturing same (2025-01-14),

8. 12165979 - Packaging substrate and semiconductor apparatus comprising same (2024-12-10),

9. 12027454 - Packaging substrate having electric power transmitting elements on non-circular core via of core vias and semiconductor device comprising the same (2024-07-02),

10. 11981501 - Loading cassette for substrate including glass and substrate loading method to which same is applied (2024-05-14),

11. 11967542 - Packaging substrate, and semiconductor device comprising same (2024-04-23),

12. 11728259 - Packaging substrate having electric power transmitting elements on non-circular core via of core vias and semiconductor device comprising the same (2023-08-15),

13. 11652039 - Packaging substrate with core layer and cavity structure and semiconductor device comprising the same (2023-05-16),

14. 11469167 - Packaging substrate having electric power transmitting elements on non-circular core via of core vias and semiconductor device comprising the same (2022-10-11),

15. 11437308 - Packaging glass substrate for semiconductor, a packaging substrate for semiconductor, and a semiconductor apparatus (2022-09-06),

Title: Inventor Jincheol Kim: Revolutionizing Technology in Hwaseong-si, KR

Introduction: Jincheol Kim is a visionary inventor based in Hwaseong-si, South Korea, known for his groundbreaking contributions to the field of technology.

Latest Patents: Kim holds several patents in the areas of artificial intelligence, robotics, and renewable energy technologies, showcasing his innovative mindset and forward-thinking approach.

Career Highlights: With a career spanning over two decades, Jincheol Kim has worked with leading tech companies in South Korea, spearheading projects that have pushed the boundaries of technological advancements.

Collaborations: Kim has collaborated with top research institutions and universities in South Korea, fostering a culture of innovation and knowledge-sharing to drive progress in the tech industry.

Conclusion: Inventor Jincheol Kim's relentless pursuit of innovation and his passion for creating technology that shapes the future make him a prominent figure in the world of inventions.