The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 2026
Filed:
Jul. 21, 2022
Substrate comprising a lid structure, package substrate comprising the same and semiconductor device
Applicant:
Absolics Inc., Covington, GA (US);
Inventors:
Sungjin Kim, Suwanee, GA (US);
Jincheol Kim, Suwon-si, KR;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10W 40/22 (2026.01); H10W 40/60 (2026.01); H10W 76/12 (2026.01); H10W 76/60 (2026.01);
U.S. Cl.
CPC ...
H10W 40/22 (2026.01); H10W 76/60 (2026.01); H10W 40/641 (2026.01); H10W 76/12 (2026.01);
Abstract
Example embodiments provide a package substrate including a lid structure. The package substrate includes a substrate, a semiconductor element arranged on one surface of the substrate, and a lid surrounding at least a portion of the semiconductor element. The lid includes a region extending outwardly beyond the outer periphery of the substrate.