For the Inventor, By the Inventor

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Covington, GA, United States of America

Absolics Inc.

USPTO Granted Patents = 19

EPO Patents = 14

Forward Citations = 6

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18 inventors (with patents filed for the assignee):

Sungjin Kim (16 out of 16 patents)

Jincheol Kim (15 out of 15 patents)

Youngho Rho (12 out of 12 patents)

4. Byungkyu Jang (7 out of 7 patents)

5. Si Hun Lee (2 out of 2 patents)

6. Tae Kyoung Kim (1 out of 1 patent)

7. Byungjoo Park (1 out of 1 patent)

8. Young Woo You (1 out of 1 patent)

9. Gyunghwan Kim (1 out of 1 patent)

10. Hyoungjune Lee (1 out of 1 patent)

11. Jaijoon Yang (1 out of 1 patent)

12. Shin Je Kim (1 out of 1 patent)

13. Bongyeol Lee (0 patent)

14. Hyejin Kim (0 patent)

15. Yong Ha Woo (0 patent)

19 patents: Sort by Forward Citations

1. 12751303 - Method of manufacturing packaging substrate and packaging substrate manufactured thereby (2026-09-29),

2. 12740462 - Packaging substrate, method of manufacturing an element package and method of manufacturing packaging substrate (2026-09-15),

3. 12740443 - Via connection structure comprising multiple vias and substrate comprising the same (2026-09-15),

4. D1132264 - Substrate holder (2026-06-30),

5. 12672541 - Substrate comprising a lid structure, package substrate comprising the same and semiconductor device (2026-06-30),

6. 12506040 - Packaging substrate, semiconductor package, packaging substrate preparation method, and semiconductor package preparation method (2025-12-23),

7. 12469736 - Substrate carrier and substrate assembly comprising the same (2025-11-11),

8. 12456672 - Packaging substrate having element group in cavity unit and semiconductor device comprising the same (2025-10-28),

9. 12456653 - Packaging substrate and semiconductor device comprising the same (2025-10-28),

10. 12288742 - Packaging substrate and semiconductor apparatus comprising same (2025-04-29),

11. 12198994 - Packaging substrate and method for manufacturing same (2025-01-14),

12. 12165979 - Packaging substrate and semiconductor apparatus comprising same (2024-12-10),

13. 12027454 - Packaging substrate having electric power transmitting elements on non-circular core via of core vias and semiconductor device comprising the same (2024-07-02),

14. 11981501 - Loading cassette for substrate including glass and substrate loading method to which same is applied (2024-05-14),

15. 11967542 - Packaging substrate, and semiconductor device comprising same (2024-04-23),

Absolics Inc. is a cutting-edge technology company specializing in developing innovative solutions for the healthcare industry. With a team of highly skilled professionals, we are committed to revolutionizing the way healthcare is delivered and managed. Our unique products and services are designed to improve patient outcomes, reduce costs, and streamline processes for healthcare providers. Visit our website to learn more about our offerings and how we can help your organization thrive in today's ever-evolving healthcare landscape.

Profile summary based on public USPTO records.

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USPTO Data Jan 1 1976 - Sep 29 2026

19 Patents

#4 in Covington, GA

#321 in Georgia

#17,113 in US

#32,592 in the World

Covington, GA, United States of America

Absolics Inc.

Forward Citations = 6

18 inventors:

Sungjin Kim (16 out of 16 patents)

Jincheol Kim (15 out of 15 patents)

Youngho Rho (12 out of 12 patents)

4. Byungkyu Jang (7 out of 7 patents)

5. Si Hun Lee (2 out of 2 patents)

Please report any incorrect information to [email protected]

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