For the Inventor, By the Inventor

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Covington, GA, United States of America

Absolics Inc.

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USPTO Granted Patents = 20

EPO Patents = 14

Forward Citations = 6

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20 inventors (with patents filed for the assignee):

Sungjin Kim (16 out of 16 patents)

Jincheol Kim (15 out of 15 patents)

Youngho Rho (12 out of 12 patents)

4. Byungkyu Jang (7 out of 7 patents)

5. Si Hun Lee (2 out of 2 patents)

6. Tae Kyoung Kim (1 out of 1 patent)

7. Byungjoo Park (1 out of 2 patents)

8. Young Woo You (1 out of 1 patent)

9. Gyunghwan Kim (1 out of 1 patent)

10. Hyoungjune Lee (1 out of 1 patent)

11. Jaijoon Yang (1 out of 1 patent)

12. Shin Je Kim (1 out of 1 patent)

13. Jae Won Lee (1 out of 1 patent)

14. Chaemook Lim (1 out of 1 patent)

15. Bongyeol Lee (0 patent)

20 patents: Sort by Forward Citations

1. 12752438 - Substrate gripper and method for moving a substrate using the same (2026-10-06),

2. 12751303 - Method of manufacturing packaging substrate and packaging substrate manufactured thereby (2026-09-29),

3. 12740462 - Packaging substrate, method of manufacturing an element package and method of manufacturing packaging substrate (2026-09-15),

4. 12740443 - Via connection structure comprising multiple vias and substrate comprising the same (2026-09-15),

5. D1132264 - Substrate holder (2026-06-30),

6. 12672541 - Substrate comprising a lid structure, package substrate comprising the same and semiconductor device (2026-06-30),

7. 12506040 - Packaging substrate, semiconductor package, packaging substrate preparation method, and semiconductor package preparation method (2025-12-23),

8. 12469736 - Substrate carrier and substrate assembly comprising the same (2025-11-11),

9. 12456672 - Packaging substrate having element group in cavity unit and semiconductor device comprising the same (2025-10-28),

10. 12456653 - Packaging substrate and semiconductor device comprising the same (2025-10-28),

11. 12288742 - Packaging substrate and semiconductor apparatus comprising same (2025-04-29),

12. 12198994 - Packaging substrate and method for manufacturing same (2025-01-14),

13. 12165979 - Packaging substrate and semiconductor apparatus comprising same (2024-12-10),

14. 12027454 - Packaging substrate having electric power transmitting elements on non-circular core via of core vias and semiconductor device comprising the same (2024-07-02),

15. 11981501 - Loading cassette for substrate including glass and substrate loading method to which same is applied (2024-05-14),

Company Overview

Absolics Inc. is a technology-driven company based in Covington, Georgia, specializing in advanced materials and innovative solutions for various industries. The organization focuses on developing cutting-edge technologies that enhance performance and sustainability in applications ranging from electronics to automotive components. With a commitment to research and development, Absolics aims to address complex challenges through its expertise in material science and engineering, contributing to the advancement of modern manufacturing and product design.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 27 2026

20 Patents

#4 in Covington, GA

#307 in Georgia

#16,416 in US

#31,315 in the World

Covington, GA, United States of America

Absolics Inc.

Forward Citations = 6

20 inventors:

Sungjin Kim (16 out of 16 patents)

Jincheol Kim (15 out of 15 patents)

Youngho Rho (12 out of 12 patents)

4. Byungkyu Jang (7 out of 7 patents)

5. Si Hun Lee (2 out of 2 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Absolics Inc.. Retrieved from https://idiyas.com/company/absolics

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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