The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 28, 2025
Filed:
Mar. 01, 2023
Packaging substrate having element group in cavity unit and semiconductor device comprising the same
Absolics Inc., Covington, GA (US);
Sungjin Kim, Suwanee, GA (US);
Youngho Rho, Daejeon, KR;
Jincheol Kim, Hwaseong-si, KR;
Byungkyu Jang, Suwon-Si, KR;
Abstract
An embodiment relates to a packaging substrate and a semiconductor device. The semiconductor device includes an element unit having a semiconductor element and a packaging substrate electrically connected to the element unit. A glass substrate is applied as a core of the packaging substrate to improve electrical performance, such as signal transmission rate, by reducing the connection distance between the semiconductor element and a motherboard. The structure enables shorter signal transmission paths, suppresses the generation of parasitic elements, and simplifies processing of the insulating layer. As a result, the packaging substrate is suitable for high-speed circuit applications.