The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2025
Filed:
Mar. 12, 2020
Absolics Inc., Covington, GA (US);
Sungjin Kim, Suwanee, GA (US);
Youngho Rho, Daejeon, KR;
Jincheol Kim, Hwaseong-si, KR;
Byungkyu Jang, Suwon-si, KR;
Absolics Inc., Covington, GA (US);
Abstract
An embodiment relates to a packaging substrate and a semiconductor device, the semiconductor device comprising: an element unit including a semiconductor element; and a packaging substrate electrically connected to the element unit, wherein a glass substrate is used as the core of the packaging substrate so as to achieve a closer connection between the semiconductor element and a motherboard, thereby allowing an electrical signal to be transmitted over as short a distance as possible. Accordingly, provided is a packaging substrate which can significantly improve electrical characteristics such as signal transmission speed, can substantially prevent the occurrence of a parasitic element and thus more simplify the insulation layer treatment process, and can be applied to a high-speed circuit.