The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 15, 2026
Filed:
Sep. 28, 2023
Absolics Inc., Covington, GA (US);
Sungjin Kim, Covington, GA (US);
Si Hun Lee, Hwaseong-si, KR;
Absolics Inc., Covington, GA (US);
Abstract
The present specification relates to a method of manufacturing a packaging substrate and a packaging substrate manufactured thereby. The packaging substrate according to the present specification includes a core layer comprising a glass core and a cavity portion, wherein the glass core is a glass substrate having a first surface and a second surface facing each other, the cavity portion has an accommodation space for accommodating an electronic element as a part of the glass core is recessed or penetrated, and the element package is placed in the accommodation space of the cavity portion, wherein the element package comprises i) a plurality of arranged electronic elements; and ii) a molding portion containing a molding material and the molding portion arranges for the molding material to surround the electronic elements, and a concave portion having arranged dimples is disposed in some of the molding portion at the element package.