The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 10, 2024
Filed:
Aug. 19, 2021
Absolics Inc., Covington, GA (US);
Sungjin Kim, Suwanee, GA (US);
Youngho Rho, Daejeon, KR;
Jincheol Kim, Hwaseong-si, KR;
Byungkyu Jang, Suwon-si, KR;
ABSOLICS INC., Covington, GA (US);
Abstract
A semiconductor apparatus includes a semiconductor element unit comprising one or more semiconductor elements, a packaging substrate, and a motherboard. The packaging substrate, connected to the semiconductor elements, includes a core layer and an upper layer disposed on the core layer. The core layer includes a glass substrate, a core via, and a core distribution layer. The glass substrate having a first surface and a second surface facing each other. A part of the core distribution layer connects electrically conductive layers of the first surface and an electrically conductive layer of the second surface through the core via penetrating through the glass substrate. A thickness of a thinner one among electrically conductive layers of the core distribution layer is the same as or greater than a width of a thinner one among the electrically conductive layers of the upper layer.