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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12027454 B1

PDFFull Text
Date of Patent:
Jul. 02, 2024

Filed:

May. 25, 2023

Packaging substrate having electric power transmitting elements on non-circular core via of core vias and semiconductor device comprising the same

Applicant:

Absolics Inc., Covington, GA (US);

Inventors:

Youngho Rho, Daejeon, KR;

Sungjin Kim, Suwanee, GA (US);

Jincheol Kim, Hwaseong-si, KR;

Assignee:

Absolics Inc., Covington, GA (US);

Attorney:

NSIP Law

Primary Examiner:

Michael Jung

Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/768 (2006.01); H01L 23/15 (2006.01); H01L 25/18 (2023.01); H10B 80/00 (2023.01); H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 21/486 (2013.01); H01L 21/76871 (2013.01); H01L 23/15 (2013.01); H01L 23/49838 (2013.01); H01L 23/49866 (2013.01); H01L 25/18 (2013.01); H10B 80/00 (2023.02); H01L 21/30604 (2013.01);
Abstract

A packaging substrate includes a core layer including a glass substrate with a first surface and a second surface facing each other, and a plurality of core vias. The plurality of core vias penetrating through the glass substrate in a thickness direction, each comprising a circular core via having a circular opening part and a non-circular core via having an aspect ratio of 2 to 25 in the x-y direction of an opening part. One or more electric power transmitting elements are disposed on the non-circular core via.

Find Patent Forward Citations

Rho, Youngho. (2024). Packaging substrate having electric power transmitting elements on non-circular core via of core vias and semiconductor device comprising the same (U.S. Patent No. 12027454). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12027454

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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