The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 16, 2023
Filed:
Mar. 12, 2020
Applicant:
Absolics Inc., Covington, GA (US);
Inventors:
Sungjin Kim, Suwanee, GA (US);
Youngho Rho, Daejeon, KR;
Jincheol Kim, Hwaseong-si, KR;
Byungkyu Jang, Suwon-si, KR;
Assignee:
ABSOLICS INC., Covington, GA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/49894 (2013.01);
Abstract
A packaging substrate and a semiconductor device comprising a semiconductor element, include a core layer and an upper layer disposed on the core layer, and the core layer includes a glass substrate as a core of the packaging substrate to improve electrical properties such as a signal transmission rate by connecting the semiconductor element and a mother board to be closer to each other so that electrical signals are transmitted through as short a path as possible.