Ji-Eun Kim is a prominent inventor based in Gwangmyeong-si, South Korea. She has made significant contributions to the field of printed circuit board (PCB) technology, holding a total of 12 patents. Her innovative methods have advanced the manufacturing processes of PCBs, enhancing their functionality and efficiency.

Latest Patents

One of Ji-Eun Kim's latest patents is a method of manufacturing a printed circuit board having a bump. This method involves preparing a first carrier with a first circuit, compressing it to an insulation layer, and forming the bump through etching. This innovation reduces the height difference between bumps, improving electrical connections between electronic components and the PCB. Another notable patent is for a single-layered printed circuit board and its manufacturing method. This method includes forming a bonding pad and circuit pattern on an insulation film, pressing an insulator, and selectively etching to expose parts of the bonding pad. These advancements showcase her commitment to enhancing PCB technology.

Career Highlights

Ji-Eun Kim is currently employed at Samsung Electro-Mechanics Co., Ltd., where she continues to develop cutting-edge technologies in the electronics sector. Her work has not only contributed to her company's success but has also positioned her as a leader in PCB innovation.

Collaborations

Throughout her career, Ji-Eun Kim has collaborated with talented individuals such as Jung-Hyun Park and Myung-Sam Kang. These partnerships have fostered a creative environment that has led to groundbreaking advancements in their field.

Conclusion

Ji-Eun Kim's contributions to printed circuit board technology are noteworthy and impactful. Her innovative patents and dedication to her work at Samsung Electro-Mechanics Co., Ltd. highlight her as a key figure in the electronics industry.

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