The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2011
Filed:
Oct. 19, 2007
Hoe-ku Jung, Daejeon, KR;
Je-gwang Yoo, Yongin-si, KR;
Myung-sam Kang, Suwon-si, KR;
Ji-eun Kim, Gwangmyeong-si, KR;
Jeong-woo Park, Suwon-si, KR;
Jung-hyun Park, Suwon-si, KR;
Hoe-Ku Jung, Daejeon, KR;
Je-Gwang Yoo, Yongin-si, KR;
Myung-Sam Kang, Suwon-si, KR;
Ji-Eun Kim, Gwangmyeong-si, KR;
Jeong-Woo Park, Suwon-si, KR;
Jung-Hyun Park, Suwon-si, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Abstract
A method of manufacturing a circuit board is disclosed. A method of manufacturing a circuit board that includes forming a first circuit pattern on the insulation layer of a carrier, in which an insulation layer and a first seed layer are stacked in order; stacking and pressing the carrier and an insulation board with the side of the carrier having the first circuit pattern facing the insulation board; removing the carrier to transfer the first circuit pattern and the insulation layer onto the insulation board; and forming a second circuit pattern on the insulation layer transferred to the insulation board, allows fine pitch circuit patterns to enable the manufacture of fine circuit patterns of high density on the board, and allows the manufacture of a multi-layer circuit board with a simple process.