The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 05, 2011
Filed:
Mar. 20, 2009
Myung-sam Kang, Daejeon, KR;
Jung-hyun Park, Chungcheongnam, KR;
Jeong-woo Park, Suwon-si, KR;
Ji-eun Kim, Gwangmyeong-si, KR;
Myung-Sam Kang, Daejeon, KR;
Jung-Hyun Park, Chungcheongnam, KR;
Jeong-Woo Park, Suwon-si, KR;
Ji-Eun Kim, Gwangmyeong-si, KR;
Samsung Electro-Mechanics Co., Ltd., Gyunggi-do, KR;
Abstract
Disclosed is a method of manufacturing a printed circuit board. The method of manufacturing a printed circuit board having a via for connecting one layer to another layer can include forming a circuit pattern on one surface of a carrier; processing a hole corresponding to the via on one surface of the carrier; compressing the surface of the carrier into one surface of an insulation body; removing the carrier; processing a via hole on the insulation body, corresponding to a position of the hole; and forming a conductive material in the via hole, to thereby easily process a hole for forming a via and have high design freedom.