The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2014
Filed:
Feb. 01, 2011
Young-ji Kim, Daejeon, KR;
Kyung-ro Yoon, Daejeon, KR;
Sang-duck Kim, Chungjoo-si, KR;
Jung-hyun Park, Hwasung-si, KR;
Nam-keun OH, Daejeon, KR;
Jong-gyu Choi, Choongchungnam-Do, KR;
Ji-eun Kim, Gwangmyung-si, KR;
Young-Ji Kim, Daejeon, KR;
Kyung-Ro Yoon, Daejeon, KR;
Sang-Duck Kim, Chungjoo-si, KR;
Jung-Hyun Park, Hwasung-si, KR;
Nam-Keun Oh, Daejeon, KR;
Jong-Gyu Choi, Choongchungnam-Do, KR;
Ji-Eun Kim, Gwangmyung-si, KR;
Samsung Electro-Mechanics Co., Ltd., Gyunggi-Do, KR;
Abstract
A single layered printed circuit board and a method of manufacturing the same are disclosed. In accordance with an embodiment of the present invention, the method can include forming a bonding pad, a circuit pattern and a post on a surface of an insulation film, in which one end part of the post is electrically connected to at least a portion of the circuit pattern, pressing an insulator on the surface of the insulation film, in which the circuit pattern and the post are buried in the insulator, selectively etching the insulator such that the other end part of the post is exposed, and opening a portion of the insulation film such that at least a portion of the bonding pad is exposed.