Sang-Duck Kim

Title: Innovations of Sang-Duck Kim in Printed Circuit Board Technology

Introduction

Sang-Duck Kim is a notable inventor based in Chingjoo-si, South Korea. He has made significant contributions to the field of printed circuit board (PCB) technology, holding a total of 4 patents. His work focuses on improving the manufacturing processes and functionalities of PCBs, which are essential components in electronic devices.

Latest Patents

One of his latest patents is a method of manufacturing a printed circuit board having a bump. This innovative method involves preparing a first carrier with a circuit formed on it, compressing it to an insulation layer, and forming bumps through etching. This technique reduces the height difference between bumps, enhancing electrical connections between electronic components and the PCB. Another significant patent is for a single-layered printed circuit board and its manufacturing method. This method includes forming bonding pads and circuit patterns on an insulation film, followed by selective etching to expose certain parts, thereby improving the efficiency of PCB production.

Career Highlights

Sang-Duck Kim is currently employed at Samsung Electro-Mechanics Co., Ltd., where he continues to develop advanced technologies in the PCB sector. His work has been instrumental in enhancing the performance and reliability of electronic devices.

Collaborations

He has collaborated with notable coworkers, including Jung-Hyun Park and Jong-Gyu Choi, contributing to various innovative projects within the company.

Conclusion

Sang-Duck Kim's contributions to printed circuit board technology reflect his dedication to innovation and excellence in the field. His patents not only advance manufacturing techniques but also improve the functionality of electronic devices, showcasing the importance of his work in the industry.