The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2015
Filed:
Sep. 28, 2010
Ji-eun Kim, Gwangmyung-si, KR;
Nam-keun OH, Daejeon, KR;
Jung-hyun Park, Hwasung-si, KR;
Young-ji Kim, Daejeon, KR;
Jong-gyu Choi, Choongchungnam-Do, KR;
Sang-duck Kim, Chingjoo-si, KR;
Ji-Eun Kim, Gwangmyung-si, KR;
Nam-Keun Oh, Daejeon, KR;
Jung-Hyun Park, Hwasung-si, KR;
Young-Ji Kim, Daejeon, KR;
Jong-Gyu Choi, Choongchungnam-Do, KR;
Sang-Duck Kim, Chingjoo-si, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon-Si, KR;
Abstract
A method of manufacturing a printed circuit board having a bump is disclosed. The method includes preparing a first carrier having a first circuit formed thereon, compressing the first carrier to one surface of an insulation layer such that the first circuit is buried, stacking an etching resist on the first carrier in accordance with where the bump is to be formed and forming the bump by etching the first carrier. In accordance with an embodiment of the present invention, the difference in height between a bump and its adjacent bump in a printed circuit board can be reduced, and thus electrical connection between an electronic component and the printed circuit board can be better implemented.