The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2013
Filed:
Oct. 19, 2007
Sang-duck Kim, Suwon-si, KR;
Jung-hyun Park, Suwon-si, KR;
Hoe-ku Jung, Daejeon, KR;
Jong-gyu Choi, Seoul, KR;
Ji-eun Kim, Gwangmyeong-si, KR;
Jeong-woo Park, Suwon-si, KR;
Sang-Duck Kim, Suwon-si, KR;
Jung-Hyun Park, Suwon-si, KR;
Hoe-Ku Jung, Daejeon, KR;
Jong-Gyu Choi, Seoul, KR;
Ji-Eun Kim, Gwangmyeong-si, KR;
Jeong-Woo Park, Suwon-si, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Abstract
A method for forming transcriptional circuits and a method for manufacturing a circuit board are disclosed. A method of forming a transcriptional circuit, which includes forming an intaglio pattern corresponding to a circuit pattern by selectively forming a resist on a mold board, filling conductive material in the intaglio pattern, and transferring the conductive material onto a carrier by pressing the carrier onto the mold board such that the carrier faces the surface of the mold board having the conductive material filled in, makes it possible to form transcriptional circuits that can be transcribed into an insulation board using existing equipment, whereby costs can be reduced.