The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2011
Filed:
Oct. 19, 2007
Hoe-ku Jung, Daejeon, KR;
Je-gwang Yoo, Yongin-si, KR;
Myung-sam Kang, Suwon-si, KR;
Ji-eun Kim, Gwangmyeong-si, KR;
Jeong-woo Park, Suwon-si, KR;
Jung-hyun Park, Suwon-si, KR;
Hoe-Ku Jung, Daejeon, KR;
Je-Gwang Yoo, Yongin-si, KR;
Myung-Sam Kang, Suwon-si, KR;
Ji-Eun Kim, Gwangmyeong-si, KR;
Jeong-Woo Park, Suwon-si, KR;
Jung-Hyun Park, Suwon-si, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Abstract
A method of manufacturing a circuit board, which includes a bump pad on which a solder bump may be placed, may include forming a solder pad on a surface of a first carrier; forming a metal film, which covers the solder pad and which extends to a bump pad forming region; forming a circuit layer and a circuit pattern, which are electrically connected with the metal film, on a surface of the first carrier; pressing the first carrier and an insulator such that a surface of the first carrier and the insulator faces each other; and removing the first carrier. Utilizing this method, the amount of solder for the contacting of a flip chip can be adjusted, and solder can be filled inside the board, so that after installing a chip, the overall thickness of the package can be reduced.