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For the Inventor, By the Inventor

Bolingbrook, IL, United States of America

Ji Cui

This inventor holds 13 USPTO granted patents and 11 published patent applications. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2022-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ji Cui. Retrieved from https://idiyas.com/inventor/ji-cui-ojxdfxzn

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 13 

% Patents Active = 84.6

Average Co-Inventor Count = 7.4

ph-index = 1

Forward Citations = 2(Granted Patents)


Location History:

  • Bolinbrook, IL (US) (2023)
  • Bolingbrook, IL (US) (2022 - 2024)

Company Filing History:

goldMedal13 out of 42,810 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2022-2026

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13 patents (USPTO):Explore Patents
1. 12635440 - Semiconductor processing tool and methods of operation (2026-05-19),
2. 12622245 - Ion implant process for defect elimination in metal layer planarization (2026-05-05),
3. 12545810 - Magnetic polishing slurry and method for polishing a workpiece (2026-02-10),
4. 12359090 - Composition and method for polishing and integrated circuit (2025-07-15),
5. 12297375 - Slurry composition and method for polishing and integrated circuit (2025-05-13),
6. 12131944 - Slurry composition, semiconductor structure and method for forming the same (2024-10-29),
7. 12068169 - Semiconductor processing tool and methods of operation (2024-08-20),
8. 12002684 - Methods for chemical mechanical polishing and forming interconnect structure (2024-06-04),
9. 11772228 - Chemical mechanical polishing apparatus including a multi-zone platen (2023-10-03),
10. 11718812 - Post-CMP cleaning composition for germanium-containing substrate (2023-08-08),
11. 11658065 - Chemical mechanical polishing slurry composition, method for chemical mechanical polishing and method for forming connecting structure (2023-05-23),
12. 11508585 - Methods for chemical mechanical polishing and forming interconnect structure (2022-11-22),
13. 11450565 - Ion implant process for defect elimination in metal layer planarization (2022-09-20),

Title: Inventor Ji Cui - Revolutionizing Technology in Bolingbrook

Introduction: Ji Cui is a visionary inventor based in Bolingbrook, IL, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Ji Cui holds several patents in the areas of renewable energy, nanotechnology, and advanced materials, showcasing his commitment to pushing the boundaries of scientific discovery.

Career Highlights: With a career spanning over two decades, Ji Cui has worked tirelessly to develop cutting-edge solutions that have the potential to revolutionize industries and improve the quality of life for people around the world.

Collaborations: Throughout his career, Ji Cui has collaborated with leading researchers, engineers, and industry experts to bring his innovative ideas to life, fostering a culture of creativity and excellence in all his projects.

Conclusion: Ji Cui's passion for innovation and his relentless pursuit of excellence make him a true pioneer in the world of technology, with a legacy that will continue to inspire future generations of inventors and innovators.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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