The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2025
Filed:
Jan. 05, 2021
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Ji Cui, Bolingbrook, IL (US);
Chi-Jen Liu, Taipei, TW;
Liang-Guang Chen, Hsinchu, TW;
Kei-Wei Chen, Tainan, TW;
Chun-Wei Hsu, Hsinchu, TW;
Li-Chieh Wu, Hsinchu, TW;
Peng-Chung Jangjian, Hsinchu, TW;
Kao-Feng Liao, Hsinchu, TW;
Fu-Ming Huang, Changhua County, TW;
Wei-Wei Liang, Hsinchu, TW;
Tang-Kuei Chang, Tainan, TW;
Hui-Chi Huang, Hsinchu County, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Abstract
A slurry composition, a polishing method and an integrated circuit are provided. The slurry composition includes a slurry and at least one rheology modifier. The slurry includes at least one liquid carrier, at least one abrasives and at least one oxidizer. The rheology modifier is dispensed in the slurry. The polishing method includes using the slurry composition with the rheology modifier to polish a conductive layer.