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For the Inventor, By the Inventor

Hsinchu, Taiwan

Liang-Guang Chen

This inventor holds 75 USPTO granted patents and 15 published patent applications, primarily in Chemical Mechanical Polishing (CPC class H01L). Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2006-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Liang-Guang Chen. Retrieved from https://idiyas.com/inventor/liang-guang-chen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 75 

% Patents Active = 77.3

Average Co-Inventor Count = 5.4

ph-index = 6

Forward Citations = 114(Granted Patents)

Forward Citations (Not Self Cited) = 101(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Yilan, TW (2006)
  • Jhuangwei Township, Yilan County, TW (2011)
  • Hsinchu, TW (2013 - 2024)

Company Filing History:

goldMedal75 out of 42,872 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2006-2026

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Areas of Expertise:
Chemical Mechanical Polishing
Slurry Composition
Semiconductor Cleaning
Abrasive Slurry
CMP Apparatus
Interconnect Structure
Defect Detection
Metal Heterojunction
Fin Field-Effect Transistor
Post-CMP Cleaning
Integrated Circuit
Wet Chemical Heating
75 patents (USPTO):Explore Patents
1. 12635440 - Semiconductor processing tool and methods of operation (2026-05-19),
2. 12550695 - Methods of forming an abrasive slurry and methods for chemical-mechanical polishing (2026-02-10),
3. 12521838 - Microwave and infrared heating units for wet chemicals (2026-01-13),
4. 12486479 - Semiconductor device cleaning solution, method of use, and method of manufacture (2025-12-02),
5. 12427618 - Chemical-mechanical planarization pad and methods of use (2025-09-30),
6. 12359090 - Composition and method for polishing and integrated circuit (2025-07-15),
7. 12347735 - In-situ defect count detection in post chemical mechanical polishing (2025-07-01),
8. 12325102 - Chemical mechanical polishing apparatus and method (2025-06-10),
9. 12297375 - Slurry composition and method for polishing and integrated circuit (2025-05-13),
10. 12224179 - Metal heterojunction structure with capping metal layer (2025-02-11),
11. 12172263 - Chemical mechanical planarization tool (2024-12-24),
12. 12170195 - Post-CMP cleaning and apparatus (2024-12-17),
13. 12131944 - Slurry composition, semiconductor structure and method for forming the same (2024-10-29),
14. 12068169 - Semiconductor processing tool and methods of operation (2024-08-20),
15. 12002684 - Methods for chemical mechanical polishing and forming interconnect structure (2024-06-04),

Title: The Innovative Journey of Inventor Liang-Guang Chen

Introduction: Liang-Guang Chen, a talented inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents: Chen's latest patents include advancements in semiconductor technology, renewable energy systems, and artificial intelligence algorithms, showcasing his diverse range of expertise and forward-thinking approach.

Career Highlights: With a career spanning over two decades, Liang-Guang Chen has worked with leading tech companies in Taiwan, spearheading research and development projects that have resulted in numerous successful patents and cutting-edge products.

Collaborations: Chen has collaborated with top research institutions and universities worldwide, fostering a culture of innovation and knowledge-sharing. His partnerships have led to the development of revolutionary technologies that have shaped various industries.

Conclusion: Liang-Guang Chen's relentless pursuit of innovation and his passion for pushing the boundaries of technology have solidified his reputation as a visionary inventor in the global tech community.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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