Kao-Feng Liao

Title: Innovations by Kao-Feng Liao: Advanced Chemical Mechanical Polishing Techniques

Introduction

Kao-Feng Liao is a prolific inventor based in Hsinchu, Taiwan, known for his significant contributions to the field of chemical mechanical polishing (CMP). With an impressive portfolio of 16 patents, Liao has developed innovative methods and compositions that enhance the CMP process, making it more efficient and effective for substrate treatment.

Latest Patents

Liao's recent patents focus on novel CMP slurry formulations and methodology. His first patent, titled "Chemical mechanical polish slurry and method of manufacture," covers the processes for manufacturing a CMP slurry characterized by a balanced concentration ratio of chelator additives to inhibitor additives. This innovative approach optimizes the electro potential value of metal materials found in substrates during polishing.

Another of his recent innovations is a patent for a "Chemical mechanical polishing method," outlining a planarization technique that differentiates between regions of varying hydrophobicity or hydrophilicity on a substrate. This method utilizes polishing slurry that maintains specific contact angle differences throughout the polishing process, ensuring a precise and controlled surface treatment for improved results.

Career Highlights

Kao-Feng Liao has had a distinguished career, working with esteemed organizations such as Taiwan Semiconductor Manufacturing Company (TSMC) and the Industrial Technology Research Institute. His role at TSMC allowed him to apply his expertise in CMP methods to some of the most advanced semiconductor manufacturing processes in the world.

Collaborations

Throughout his career, Liao has collaborated with notable colleagues, including Kei-Wei Chen and Chun-Hao Kung. These partnerships have contributed significantly to the innovative advancements in CMP and have strengthened the research community's understanding of substrate polishing techniques.

Conclusion

Kao-Feng Liao's contributions to the field of chemical mechanical polishing have transformed practices within the semiconductor industry. His innovative approaches to slurry formulation and polishing methods continue to influence and inspire advancements in substrate treatment technologies. As he adds to his portfolio of patents, his impact on the industry will undoubtedly grow, establishing him as a key figure in research and development.