The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 20, 2023
Filed:
Aug. 23, 2019
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Michael Yen, Hsinchu, TW;
Kao-Feng Liao, Hsinchu, TW;
Hsin-Ying Ho, Kaohsiung, TW;
Chun-Wen Hsiao, Hsinchu, TW;
Sheng-Chao Chuang, Hsinchu, TW;
Ting-Hsun Chang, Kaohsiung, TW;
Fu-Ming Huang, Shengang Township, TW;
Chun-Chieh Lin, Hsinchu, TW;
Peng-Chung Jangjian, Zhudong Township, TW;
Ji James Cui, Hsinchu, TW;
Liang-Guang Chen, Hsinchu, TW;
Chih Hung Chen, Hsinchu, TW;
Kei-Wei Chen, Tainan, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
A chemical mechanical planarization (CMP) tool includes a platen and a polishing pad attached to the platen, where a first surface of the polishing pad facing away from the platen includes a first polishing zone and a second polishing zone, where the first polishing zone is a circular region at a center of the first surface of the polishing pad, and the second polishing zone is an annular region around the first polishing zone, where the first polishing zone and the second polishing zone have different surface properties.