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For the Inventor, By the Inventor

Shengang, Taiwan

Fu-Ming Huang

This inventor holds 21 USPTO granted patents and 4 published patent applications, plus 1 CIPO patent, primarily in Chemical Mechanical Planarization. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2015-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Fu-Ming Huang. Retrieved from https://idiyas.com/inventor/fu-ming-huang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 21 

% Patents Active = 71.4


Average Co-Inventor Count = 5.4

ph-index = 2

Forward Citations = 35(Granted Patents)


Location History:

  • Hsin-Chu, TW (2019)
  • Changhua County, TW (2016 - 2022)
  • Shengang Township, TW (2015 - 2023)
  • Changhua, TW (2023)

Company Filing History:

goldMedal21 out of 42,872 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2015-2026

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Areas of Expertise:
Chemical Mechanical Planarization
Ion Implant Process
Defect Elimination
Metal Layer Planarization
Post-CMP Cleaning
Polishing Apparatus
Interconnect Structure
Slurry Composition
Debris Removal
Fabrication Methods
Measurement Noise Reduction
Brush Cleaning
21 patents (USPTO):Explore Patents
1. 12622245 - Ion implant process for defect elimination in metal layer planarization (2026-05-05),
2. 12172263 - Chemical mechanical planarization tool (2024-12-24),
3. 12170195 - Post-CMP cleaning and apparatus (2024-12-17),
4. 11772228 - Chemical mechanical polishing apparatus including a multi-zone platen (2023-10-03),
5. 11728157 - Post-CMP cleaning and apparatus (2023-08-15),
6. 11679469 - Chemical mechanical planarization tool (2023-06-20),
7. 11658065 - Chemical mechanical polishing slurry composition, method for chemical mechanical polishing and method for forming connecting structure (2023-05-23),
8. 11508585 - Methods for chemical mechanical polishing and forming interconnect structure (2022-11-22),
9. 11450565 - Ion implant process for defect elimination in metal layer planarization (2022-09-20),
10. 11322345 - Post-CMP cleaning and apparatus (2022-05-03),
11. 10269555 - Post-CMP cleaning and apparatus (2019-04-23),
12. 10062645 - Interconnect structure for semiconductor devices (2018-08-28),
13. 9962805 - Chemical mechanical polishing apparatus and method (2018-05-08),
14. 9723915 - Brush cleaning method (2017-08-08),
15. 9679848 - Interconnect structure for semiconductor devices (2017-06-13),

Title: The Innovative Journey of Fu-Ming Huang

Introduction: Fu-Ming Huang, a distinguished inventor hailing from Shengang, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents: Fu-Ming Huang's latest patents include advancements in renewable energy technologies, smart home devices, and medical equipment, showcasing his versatility and forward-thinking approach to innovation.

Career Highlights: With a career spanning over two decades, Fu-Ming Huang has established himself as a visionary inventor with a keen eye for identifying gaps in the market and developing solutions that push the boundaries of what is possible. His innovative spirit has led to the creation of numerous patented technologies that have revolutionized various industries.

Collaborations: Throughout his career, Fu-Ming Huang has collaborated with leading research institutions, universities, and tech companies to bring his inventions to life. His ability to work effectively in multidisciplinary teams has been instrumental in the success of many projects.

Conclusion: Fu-Ming Huang's passion for innovation, coupled with his dedication to creating technologies that have a positive impact on society, sets him apart as a true pioneer in the world of inventors. His relentless pursuit of excellence and commitment to pushing the boundaries of what is possible continue to inspire the next generation of innovators.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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