The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 2023
Filed:
May. 02, 2022
Applicant:
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Inventors:
Fu-Ming Huang, Shengang Township, TW;
Liang-Guang Chen, Hsinchu, TW;
Ting-Kui Chang, New Taipei, TW;
Chun-Chieh Lin, Hsinchu, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/67 (2006.01); B08B 1/00 (2006.01); B08B 1/04 (2006.01); B08B 3/04 (2006.01); H01L 21/306 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02043 (2013.01); B08B 1/002 (2013.01); B08B 1/04 (2013.01); B08B 3/04 (2013.01); H01L 21/30625 (2013.01); H01L 21/67028 (2013.01); H01L 21/67046 (2013.01); H01L 21/67092 (2013.01); H01L 21/687 (2013.01); H01L 21/02065 (2013.01); H01L 21/02074 (2013.01);
Abstract
A method includes performing a first post Chemical Mechanical Polish (CMP) cleaning on a wafer using a first brush. The first brush rotates to clean the wafer. The method further includes performing a second post-CMP cleaning on the wafer using a second brush. The second brush rotates to clean the wafer. The first post-CMP cleaning and the second post-CMP cleaning are performed simultaneously.