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For the Inventor, By the Inventor

Taipei, Taiwan

Ting-Kui Chang

This inventor holds 20 USPTO granted patents and 1 published patent application, primarily in Chemical Mechanical Polishing. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2017-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ting-Kui Chang. Retrieved from https://idiyas.com/inventor/ting-kui-chang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 20 

% Patents Active = 95.0

Average Co-Inventor Count = 5.3

ph-index = 2

Forward Citations = 20(Granted Patents)


Location History:

  • Hsin-Chu, TW (2019)
  • New Taipei, TW (2017 - 2024)

Company Filing History:

goldMedal20 out of 43,553 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2017-2026

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Areas of Expertise:
Chemical Mechanical Polishing
Wafer Cleaning
Copper Vias
CMP Slurry
Interconnect Structure
Capacitance Reduction
Metal Loss Prevention
Advanced Technology Nodes
Post-CMP Cleaning
Implantation Techniques
20 patents (USPTO):Explore Patents
1. 12752394 - System and method for real time inline mixing CMP slurry (2026-10-06),
2. 12543553 - Forming liners to facilitate the formation of copper-containing vias in advanced technology nodes (2026-02-03),
3. 12444646 - Devices with reduced capacitances (2025-10-14),
4. 12170195 - Post-CMP cleaning and apparatus (2024-12-17),
5. 12068195 - Metal loss prevention using implantation (2024-08-20),
6. 12046506 - Devices with reduced capacitances (2024-07-23),
7. 12002684 - Methods for chemical mechanical polishing and forming interconnect structure (2024-06-04),
8. 11728157 - Post-CMP cleaning and apparatus (2023-08-15),
9. 11710659 - Metal loss prevention using implantation (2023-07-25),
10. 11705324 - Apparatus and method for wafer cleaning (2023-07-18),
11. 11658065 - Chemical mechanical polishing slurry composition, method for chemical mechanical polishing and method for forming connecting structure (2023-05-23),
12. 11508585 - Methods for chemical mechanical polishing and forming interconnect structure (2022-11-22),
13. 11322345 - Post-CMP cleaning and apparatus (2022-05-03),
14. 11211289 - Metal loss prevention using implantation (2021-12-28),
15. 10998184 - Apparatus and method for wafer cleaning (2021-05-04),

Title: The Innovative Journey of Ting-Kui Chang

Introduction:

Ting-Kui Chang, a pioneering inventor hailing from New Taipei, Taiwan, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents:

Chang's latest patents include advancements in renewable energy technologies, smart home devices, and sustainable transportation solutions, showcasing his commitment to creating a more efficient and eco-friendly world.

Career Highlights:

Throughout his illustrious career, Ting-Kui Chang has been recognized for his inventive spirit and problem-solving abilities. His inventions have not only revolutionized industries but have also improved the quality of life for many individuals around the globe.

Collaborations:

Chang has collaborated with leading research institutions, universities, and tech companies to further develop and implement his innovative ideas. His partnerships have led to the successful commercialization of several groundbreaking inventions.

Conclusion:

In conclusion, Ting-Kui Chang's relentless pursuit of innovation and his passion for creating impactful solutions have solidified his reputation as a visionary inventor. His work continues to inspire future generations to push the boundaries of what is possible in the world of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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