The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 23, 2023
Filed:
Jun. 15, 2020
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Ji Cui, Bolingbrook, IL (US);
Fu-Ming Huang, Changhua, TW;
Ting-Kui Chang, New Taipei, TW;
Tang-Kuei Chang, Tainan, TW;
Chun-Chieh Lin, Hsinchu, TW;
Wei-Wei Liang, Hsinchu, TW;
Chi-Hsiang Shen, Tainan, TW;
Ting-Hsun Chang, Kaohsiung, TW;
Li-Chieh Wu, Hsinchu, TW;
Hung Yen, Kaohsiung, TW;
Chi-Jen Liu, Taipei, TW;
Liang-Guang Chen, Hsinchu, TW;
Kei-Wei Chen, Tainan, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Abstract
A method for CMP includes following operations. A metal layer is received. A CMP slurry composition is provided in a CMP apparatus. The CMP slurry composition includes at least a first oxidizer and a second oxidizer different from each other. The first oxidizer is oxidized to form a peroxidant by the second oxidizer. A portion of the metal layer is oxidized to form a first metal oxide by the peroxidant. The first metal oxide is re-oxidized to form a second metal oxide by the second oxidizer.