The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2023
Filed:
Jan. 17, 2020
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Ting-Hsun Chang, Kaohsiung, TW;
Hung Yen, Kaohsiung, TW;
Chi-Hsiang Shen, Tainan, TW;
Fu-Ming Huang, Shengang Township, TW;
Chun-Chieh Lin, Hsinchu, TW;
Tsung Hsien Chang, Shalu Township, TW;
Ji Cui, Bolinbrook, IL (US);
Liang-Guang Chen, Hsinchu, TW;
Chih Hung Chen, Hsinchu, TW;
Kei-Wei Chen, Tainan, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu, TW;
Abstract
A chemical mechanical planarization apparatus includes a multi-zone platen comprising a plurality of individually controlled concentric toroids. The rotation direction, rotation speed, applied force, relative height, and temperature of each concentric toroid is individually controlled. Concentric polishing pads are affixed to an upper surface of each of the individually controlled concentric toroids. The chemical mechanical planarization apparatus includes a single central slurry source or includes individual slurry sources for each individually controlled concentric toroid.