Company Filing History:

32 out of 1,787

Kla Tencor Corporation

patents

2 out of 641

Kla-tencor Technologies Corporation

4. 1 out of 832,843

Other

patents

Years Active: 2008-2023

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36 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11761880 - Process-induced distortion prediction and feedforward and feedback correction of overlay errors (2023-09-19),

2. 10788759 - Prediction based chucking and lithography control optimization (2020-09-29),

3. 10576603 - Patterned wafer geometry measurements for semiconductor process controls (2020-03-03),

4. 10401279 - Process-induced distortion prediction and feedforward and feedback correction of overlay errors (2019-09-03),

5. 10379061 - Systems, methods and metrics for wafer high order shape characterization and wafer classification using wafer dimensional geometry tool (2019-08-13),

6. 10352691 - Systems and methods for wafer structure uniformity monitoring using interferometry wafer geometry tool (2019-07-16),

7. 10330608 - Systems and methods for wafer surface feature detection, classification and quantification with wafer geometry metrology tools (2019-06-25),

8. 10249523 - Overlay and semiconductor process control using a wafer geometry metric (2019-04-02),

9. 10036964 - Prediction based chucking and lithography control optimization (2018-07-31),

10. 10025894 - System and method to emulate finite element model based prediction of in-plane distortions due to semiconductor wafer chucking (2018-07-17),

11. 9865047 - Systems and methods for effective pattern wafer surface measurement and analysis using interferometry tool (2018-01-09),

12. 9779202 - Process-induced asymmetry detection, quantification, and control using patterned wafer geometry measurements (2017-10-03),

13. 9707660 - Predictive wafer modeling based focus error prediction using correlations of wafers (2017-07-18),

14. 9702829 - Systems and methods for wafer surface feature detection and quantification (2017-07-11),

15. 9646379 - Detection of selected defects in relatively noisy inspection data (2017-05-09),

Title: Innovations by Jaydeep K Sinha in Overlay Error Prediction

Introduction

Jaydeep K Sinha is an influential inventor located in Livermore, California, who holds an impressive portfolio of 36 patents. His work primarily focuses on innovations that enhance the precision of lithography and wafer handling processes, contributing significantly to the semiconductor industry.

Latest Patents

Among his latest contributions, Sinha has developed methods for predicting and measuring overlay errors through a process called "Process-induced distortion prediction and feedforward and feedback correction of overlay errors." This innovation utilizes film force-based computational mechanics models, providing information regarding the distribution of film force to improve point-by-point predictions in situations where complex stress patterns exist.

Additionally, Sinha has introduced “Prediction-based chucking and lithography control optimization.” This innovation calculates distortions that occur when a wafer is chucked by a device, adjusting chucking parameters such as pressures and sequences to minimize overlay errors. By applying anticipatory corrections, his methods demonstrate a sophisticated control over wafer geometry.

Career Highlights

Jaydeep K Sinha has made significant strides in the field of semiconductor technologies during his tenure at renowned companies such as KLA-Tencor Corporation and KLA-Tencor Technologies Corporation. His expertise in the field has made a considerable impact on enhancing the accuracy and efficiency of manufacturing processes.

Collaborations

Sinha has collaborated with several esteemed professionals, including Pradeep Vukkadala and Haiguang Chen. These collaborations have played an essential role in refining and expanding upon his innovative techniques in overlay error prediction and lithography control.

Conclusion

Jaydeep K Sinha's contributions to the field of semiconductor technology through his numerous patents exemplify his dedication to innovation. His work not only helps in minimizing overlay errors but also optimizes process control, thereby pushing the boundaries of efficiency in the industry. As technology continues to evolve, Sinha's inventions will likely remain pivotal in advancing semiconductor manufacturing practices.

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