logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9865047 B1

PDFFull Text
Date of Patent:
Jan. 09, 2018

Filed:

Oct. 15, 2015

Systems and methods for effective pattern wafer surface measurement and analysis using interferometry tool

Applicant:

Kla-tencor Corporation, Milpitas, CA (US);

Inventors:

Haiguang Chen, Mountain View, CA (US);

Jaydeep Sinha, Livermore, CA (US);

Enrique Chavez, Tracy, CA (US);

Sathish Veeraraghavan, Santa Clara, CA (US);

Assignee:

KLA-Tencor Corporation, Milpitas, CA (US);

Attorney:

Suiter Swantz pc llo

Primary Examiner:

Wesley Tucker

Int. Cl.
CPC ...
G06K 9/00 (2006.01); G06T 7/00 (2017.01); G06K 9/52 (2006.01); G06K 9/62 (2006.01); G06K 9/46 (2006.01); G06T 5/00 (2006.01);
U.S. Cl.
CPC ...
G06T 7/001 (2013.01); G06K 9/4642 (2013.01); G06K 9/52 (2013.01); G06K 9/6201 (2013.01); G06K 9/6215 (2013.01); G06T 5/006 (2013.01); G06K 2009/4666 (2013.01); G06T 2207/30148 (2013.01);
Abstract

Systems and methods for providing improved wafer geometry measurements are disclosed. A wafer geometry measurement system may utilize techniques that enable the wafer geometry measurement system to identify and reduce wafer surface errors caused by structures such as patterns on the wafers being measured. The wafer geometry measurement system may also utilize techniques that enable the wafer geometry measurement system to accurately reconstruct patterned wafer surfaces.

Find Patent Forward Citations

Chen, Haiguang. (2018). Systems and methods for effective pattern wafer surface measurement and analysis using interferometry tool (U.S. Patent No. 9865047). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9865047

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…