The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 09, 2018
Filed:
Oct. 15, 2015
Applicant:
Kla-tencor Corporation, Milpitas, CA (US);
Inventors:
Haiguang Chen, Mountain View, CA (US);
Jaydeep Sinha, Livermore, CA (US);
Enrique Chavez, Tracy, CA (US);
Sathish Veeraraghavan, Santa Clara, CA (US);
Assignee:
KLA-Tencor Corporation, Milpitas, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2006.01); G06T 7/00 (2017.01); G06K 9/52 (2006.01); G06K 9/62 (2006.01); G06K 9/46 (2006.01); G06T 5/00 (2006.01);
U.S. Cl.
CPC ...
G06T 7/001 (2013.01); G06K 9/4642 (2013.01); G06K 9/52 (2013.01); G06K 9/6201 (2013.01); G06K 9/6215 (2013.01); G06T 5/006 (2013.01); G06K 2009/4666 (2013.01); G06T 2207/30148 (2013.01);
Abstract
Systems and methods for providing improved wafer geometry measurements are disclosed. A wafer geometry measurement system may utilize techniques that enable the wafer geometry measurement system to identify and reduce wafer surface errors caused by structures such as patterns on the wafers being measured. The wafer geometry measurement system may also utilize techniques that enable the wafer geometry measurement system to accurately reconstruct patterned wafer surfaces.