Company Filing History:

16 out of 1,787

Kla Tencor Corporation

patents

12 out of 641

Kla-tencor Technologies Corporation

4. 1 out of 832,680

Other

patents

Years Active: 2003-2023

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30 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11761880 - Process-induced distortion prediction and feedforward and feedback correction of overlay errors (2023-09-19),

2. 10401279 - Process-induced distortion prediction and feedforward and feedback correction of overlay errors (2019-09-03),

3. 10379061 - Systems, methods and metrics for wafer high order shape characterization and wafer classification using wafer dimensional geometry tool (2019-08-13),

4. 10352691 - Systems and methods for wafer structure uniformity monitoring using interferometry wafer geometry tool (2019-07-16),

5. 10330608 - Systems and methods for wafer surface feature detection, classification and quantification with wafer geometry metrology tools (2019-06-25),

6. 10025894 - System and method to emulate finite element model based prediction of in-plane distortions due to semiconductor wafer chucking (2018-07-17),

7. 9865047 - Systems and methods for effective pattern wafer surface measurement and analysis using interferometry tool (2018-01-09),

8. 9702829 - Systems and methods for wafer surface feature detection and quantification (2017-07-11),

9. 9646379 - Detection of selected defects in relatively noisy inspection data (2017-05-09),

10. 9632038 - Hybrid phase unwrapping systems and methods for patterned wafer measurement (2017-04-25),

11. 9546862 - Systems, methods and metrics for wafer high order shape characterization and wafer classification using wafer dimensional geometry tool (2017-01-17),

12. 9430593 - System and method to emulate finite element model based prediction of in-plane distortions due to semiconductor wafer chucking (2016-08-30),

13. 9355440 - Detection of selected defects in relatively noisy inspection data (2016-05-31),

14. 9177370 - Systems and methods of advanced site-based nanotopography for wafer surface metrology (2015-11-03),

15. 9031810 - Methods and systems of object based metrology for advanced wafer surface nanotopography (2015-05-12),

Title: The Innovations of Haiguang Chen: A Pioneer in Overlay Error Measurement

Introduction: Haiguang Chen is a distinguished inventor based in Mountain View, California, known for his significant contributions to the field of semiconductor technology. With an impressive portfolio of 30 patents, Chen has been at the forefront of innovations that improve the accuracy and efficiency of semiconductor manufacturing processes.

Latest Patents: Among his latest innovations, Chen has developed a groundbreaking system for the prediction and measurement of overlay errors titled "Process-induced distortion prediction and feedforward and feedback correction of overlay errors." This invention utilizes film force-based computational mechanics models to predict or measure process-induced overlay errors. By incorporating information related to the distribution of film force within a finite element (FE) model, his work enables more accurate point-by-point predictions, particularly in the presence of complex stress patterns. Additionally, his innovations enhance the prediction and measurement of wafer geometry-induced overlay errors, showcasing his commitment to advancing semiconductor manufacturing accuracy.

Career Highlights: Throughout his career, Haiguang Chen has made notable advancements while working for leading companies in the semiconductor industry, including KLA Corporation and KLA-Tencor Technologies Corporation. His ability to innovate and lead in the development of cutting-edge technologies has positioned him as a key player in improving manufacturing processes on a global scale.

Collaborations: Chen has worked alongside talented professionals, including Jaydeep K. Sinha and Kurt Lehman, to foster collaborative efforts that drive innovation. These partnerships have not only enriched his work but have also contributed to the broader advancements in semiconductor technology.

Conclusion: Haiguang Chen exemplifies the spirit of innovation in the semiconductor industry through his extensive patent portfolio and collaborative efforts. His latest patents continue to influence the field, particularly in addressing the challenges associated with overlay errors. As he progresses in his career, Chen's contributions are sure to pave the way for further advancements, making a lasting impact on the future of semiconductor manufacturing.

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5 patents pending (EPO):

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