The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 25, 2017

Filed:

Jul. 24, 2015
Applicant:

Kla-tencor Corporation, Milpitas, CA (US);

Inventors:

Haiguang Chen, Mountain View, CA (US);

Jaydeep Sinha, Livermore, CA (US);

Assignee:

KLA-Tencor Corporation, Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 21/95 (2006.01); G01B 11/24 (2006.01); G01B 11/06 (2006.01); G01N 21/88 (2006.01); G06T 7/00 (2017.01);
U.S. Cl.
CPC ...
G01N 21/9501 (2013.01); G01B 11/06 (2013.01); G01B 11/2441 (2013.01); G01N 21/8851 (2013.01); G06T 7/0004 (2013.01); G01N 2201/06113 (2013.01); G01N 2201/12 (2013.01); G06T 2207/10056 (2013.01); G06T 2207/30148 (2013.01);
Abstract

Systems and methods for unwrapping phase signals obtained from interferometry measurements of patterned wafer surfaces are disclosed. A phase unwrapping method in accordance with the present disclosure may calculate a front surface phase map and a back surface phase map of a wafer, subtract the back surface phase map from the front surface phase map to obtain a phase difference map, unwrap the phase difference map to obtain a wafer thickness variation map, unwrap the back surface phase map to obtain a back surface map representing the back surface of the wafer; and add the wafer thickness variation map to the back surface phase map to calculate a front surface map representing the front surface of the wafer.


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