The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 31, 2016

Filed:

Oct. 10, 2012
Applicant:

Kla-tencor Corporation, Milpitas, CA (US);

Inventors:

Haiguang Chen, Mountain View, CA (US);

Michael D. Kirk, San Jose, CA (US);

Stephen Biellak, Sunnyvale, CA (US);

Jaydeep Sinha, Livermore, CA (US);

Assignee:

KLA-Tencor Corp., Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06T 7/00 (2006.01); G01N 21/88 (2006.01);
U.S. Cl.
CPC ...
G06T 7/0004 (2013.01); G01N 21/8851 (2013.01); G01N 2021/8887 (2013.01); G06T 2207/20061 (2013.01); G06T 2207/30148 (2013.01);
Abstract

Methods and systems for detection of selected defects in relatively noisy inspection data are provided. One method includes applying a spatial filter algorithm to inspection data acquired across an area on a substrate to determine a first portion of the inspection data that has a higher probability of being a selected type of defect than a second portion of the inspection data. The selected type of defect includes a non-point defect. The inspection data is generated by combining two or more raw inspection data corresponding to substantially the same locations on the substrate. The method also includes generating a two-dimensional map illustrating the first portion of the inspection data. The method further includes searching the two-dimensional map for an event that has spatial characteristics that approximately match spatial characteristics of the selected type of defect and determining if the event corresponds to a defect having the selected type.


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