The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2019

Filed:

May. 11, 2012
Applicants:

Haiguang Chen, Mountain View, CA (US);

Jaydeep K. Sinha, Livermore, CA (US);

Sergey Kamensky, Campbell, CA (US);

Inventors:

Haiguang Chen, Mountain View, CA (US);

Jaydeep K. Sinha, Livermore, CA (US);

Sergey Kamensky, Campbell, CA (US);

Assignee:

KLA-Tencor Corporation, Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 21/95 (2006.01); H01L 21/66 (2006.01); G06T 7/00 (2017.01); G01N 21/88 (2006.01); G01N 21/956 (2006.01); G06T 7/12 (2017.01); G06T 7/62 (2017.01); G01B 11/02 (2006.01);
U.S. Cl.
CPC ...
G01N 21/9501 (2013.01); G01N 21/8851 (2013.01); G01N 21/956 (2013.01); G06T 7/0004 (2013.01); G06T 7/12 (2017.01); G06T 7/62 (2017.01); H01L 22/12 (2013.01); H01L 22/20 (2013.01); G01B 11/02 (2013.01); G01N 2021/8864 (2013.01); G06T 2207/30148 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Systems and methods for providing micro defect inspection capabilities for optical systems such as wafer metrology tools and interferometer systems are disclosed. The systems and methods in accordance with the present disclosure may detect, classify and quantify wafer surface features, wherein the detected defects are classified and the important defect metrology information of height/depth, area and volume is reported. The systems and methods in accordance with the present disclosure therefore provide more values for quantifying the negative effect of these defects on the wafer quality.


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