The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2020
Filed:
Jun. 24, 2014
Applicant:
Kla-tencor Corporation, Milpitas, CA (US);
Inventors:
Pradeep Vukkadala, Fremont, CA (US);
Jaydeep Sinha, Livermore, CA (US);
Assignee:
KLA-Tencor Corporation, Milpitas, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01B 21/00 (2006.01); G03F 7/20 (2006.01); B24B 37/005 (2012.01); B24B 49/00 (2012.01); G06N 20/00 (2019.01); G03F 9/00 (2006.01); G06N 7/00 (2006.01);
U.S. Cl.
CPC ...
B24B 37/005 (2013.01); B24B 49/00 (2013.01); G01B 21/00 (2013.01); G03F 7/705 (2013.01); G03F 9/7026 (2013.01); G06N 7/00 (2013.01); G06N 20/00 (2019.01); G01B 2210/48 (2013.01);
Abstract
Wafer geometry measurement tools and methods for providing improved wafer geometry measurements are disclosed. Wafer front side, backside and flatness measurements are taken into consideration for semiconductor process control. The measurement tools and methods in accordance with embodiments of the present disclosure are suitable for handling any types of wafers, including patterned wafers, without the shortcomings of conventional metrology systems.