Hwaseong, South Korea

Hyunsoo Chung

This inventor holds 44 USPTO granted patents and 76 published patent applications, primarily in Semiconductor Packaging. Top assignees: Samsung Electronics Co., Ltd., Samsung Electronics Ltd.. Active years: 2013-2026.

USPTO Granted Patents = 44 

% Patents Active = 100.0

Average Co-Inventor Count = 3.5

ph-index = 6

Forward Citations = 130(Granted Patents)


Location History:

  • Suwon-si, KR (2022)
  • Hwaseong-si, KR (2013 - 2024)

Company Filing History:


Years Active: 2013-2026

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Areas of Expertise:
Semiconductor Package
Through-Silicon Via
Dummy Pad
Heat Redistribution Layer
Conductive Bump
Stack Structure
Intermetallic Compound
Redistribution Pad
Conductive Via Structure
Microelectronic Device
Protected Barrier Layer
Through Electrode
44 patents (USPTO):Explore Patents

Title: Hyunsoo Chung: Pioneering Inventor from Hwaseong-si, South Korea

Introduction: Hyunsoo Chung is a renowned inventor hailing from Hwaseong-si, South Korea, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Hyunsoo Chung holds several patents in the areas of semiconductor devices, nanotechnology, and renewable energy technologies, showcasing his versatility and forward-thinking approach to invention.

Career Highlights: With a career spanning over two decades, Hyunsoo Chung has worked with leading research institutions and technology companies, playing a pivotal role in the development of cutting-edge technologies that have revolutionized various industries.

Collaborations: Throughout his career, Hyunsoo Chung has collaborated with top scientists, engineers, and researchers from around the world, fostering a culture of innovation and knowledge-sharing that has led to numerous breakthrough inventions.

Conclusion: Hyunsoo Chung's passion for innovation, coupled with his relentless pursuit of excellence, has solidified his reputation as a trailblazing inventor in the global technology landscape, inspiring future generations to push the boundaries of what is possible.

Profile summary based on public USPTO records.
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