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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12684786 B1

PDFFull Text
Date of Patent:
Jul. 14, 2026

Filed:

Mar. 16, 2023

Semiconductor package and method of fabricating the same

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Hyunsoo Chung, Suwon-si, KR;

Young Lyong Kim, Suwon-si, KR;

Inhyo Hwang, Suwon-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;

Attorney:

Muir Patent Law, PLLC

Primary Examiner:

Lawrence C Tynes, Jr

Int. Cl.
CPC ...
H10B 80/00 (2026.01); H01L 23/31 (2006.01); H01L 25/00 (2006.01); H10W 74/10 (2026.01); H10W 90/00 (2026.01); H10D 30/01 (2025.01); H10K 59/88 (2023.01); H10W 74/15 (2026.01);
U.S. Cl.
CPC ...
H10B 80/00 (2023.02); H10W 74/117 (2026.01); H10W 90/00 (2026.01); H10W 90/724 (2026.01); H10D 30/0243 (2025.01); H10K 59/88 (2023.02); H10W 74/15 (2026.01); H10W 90/734 (2026.01);
Abstract

A semiconductor package may include a substrate, a chip structure mounted on the substrate, and a first dummy structure attached to the chip structure. The chip structure may include a first semiconductor chip, a second dummy structure disposed at a side of the first semiconductor chip, and a mold layer enclosing the first semiconductor chip and the second dummy structure. A bottom surface of the first semiconductor chip, a bottom surface of the second dummy structure, and a bottom surface of the mold layer may be coplanar with each other.

Find Patent Forward Citations

Chung, Hyunsoo. (2026). Semiconductor package and method of fabricating the same (U.S. Patent No. 12684786). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12684786

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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