Hsiao-Wen Lee

This inventor holds 63 USPTO granted patents and 5 published patent applications and 2 EPO patents, primarily in LED Packaging Technology (CPC class H01L). Top assignees: TSMC Solid State Lighting Ltd., Taiwan Semiconductor Manufacturing Comp. Ltd., Visera Technologies Company Limited. Active years: 2002-2025.

USPTO Granted Patents = 63 (Patent Applications = 5)

% Patents Active = 76.2

EPO Patents = 2

Average Co-Inventor Count = 3.2

ph-index = 8

Forward Citations = 199(Granted Patents)

Forward Citations (Not Self Cited) = 193(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Kaohsiung, TW (2009)
Hsinchu, TW (2002 - 2024)

Company Filing History:

20 out of 117

TSMC Solid State Lighting Ltd.

patents

15 out of 42,810

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

12 out of 262

Visera Technologies Company Limited

patents

4. 8 out of 9,303

Industrial Technology Research Institute

National Sun Yat-Sen University of Kaohsiung

patents

7. 3 out of 1,412

Omnivision Technologies, Inc.

patents

where one patent can have more than one assignee

Years Active: 2002-2025

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Areas of Expertise:

Multi-Chip Packages

Integrated Fan-Out Packaging

LED Packaging

Wafer Level Packages

Image Sensor Packaging

Phosphor Coating

Light-Emitting Diodes

Thermal Management

Optical Structures

Micro-Structure Lens

Lighting Apparatus

Electrical Connectors

63 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12381180 - Multi-chip packages and methods of forming the same (2025-08-05),

2. 12062622 - Integrated fan-out packaging (2024-08-13),

3. 11798898 - Package structure (2023-10-24),

4. 11756928 - Multi-chip packages (2023-09-12),

5. 11437327 - Integrated fan-out packaging (2022-09-06),

6. 11342306 - Multi-chip wafer level packages (2022-05-24),

7. 11189596 - Methods of forming multi-chip wafer level packages (2021-11-30),

8. 11056445 - Package structure with buffer layer sandwiched between encapsulation layer and semiconductor substrate (2021-07-06),

9. 10867930 - Integrated fan-out packaging (2020-12-15),

10. 10797007 - Semiconductor structure and manufacturing method thereof (2020-10-06),

11. 10763239 - Multi-chip wafer level packages and methods of forming the same (2020-09-01),

12. 10529671 - Package structure and method for forming the same (2020-01-07),

13. 10269720 - Integrated fan-out packaging (2019-04-23),

14. 9899563 - Method of fabricating light-emitting diode with a micro-structure lens (2018-02-20),

15. 9899443 - Complementary metal-oxide-semiconductor (CMOS) image sensor (CIS) package with an image buffer (2018-02-20),

Title: The Innovative Journey of Hsiao-Wen Lee

Introduction: Hsiao-Wen Lee, a pioneering inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions.

Latest Patents: Lee's latest patents showcase his commitment to innovation, with a focus on cutting-edge technologies in the semiconductor industry, including advancements in nanotechnology and microelectronics.

Career Highlights: Throughout his illustrious career, Lee has been at the forefront of technological advancements, holding key positions in leading research institutions and companies. His expertise in semiconductor physics and materials science has led to the development of revolutionary products that have shaped the industry.

Collaborations: Lee's collaborative efforts with top researchers, engineers, and industry experts have been instrumental in bringing his inventions to life. His ability to work effectively in multidisciplinary teams has resulted in successful projects that have pushed the boundaries of innovation.

Conclusion: Hsiao-Wen Lee's relentless pursuit of innovation and his passion for pushing the limits of technology have established him as a trailblazer in the field of inventions. His contributions continue to inspire future generations of inventors and researchers to strive for excellence in their pursuit of groundbreaking discoveries.