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For the Inventor, By the Inventor

Hsinchu, Taiwan

Hsiao-Wen Lee

USPTO Granted Patents = 63 


Average Co-Inventor Count = 3.2

ph-index = 8

Forward Citations = 197(Granted Patents)

DiyaCoin DiyaCoin = 0.49 


Inventors with similar research interests:


Location History:

  • Kaohsiung, TW (2009)
  • Hsinchu, TW (2002 - 2024)

Company Filing History:

goldMedal20 out of 117 
 
TSMC Solid State Lighting Ltd.
 patents
silverMedal15 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
bronzeMedal12 out of 236 
 
Visera Technologies Company Limited
 patents
4. 8 out of 9,138 
 
Industrial Technology Research Institute
 patents
5. 4 out of 277 
 
National Sun Yat-sen University of Kaohsiung
 patents
6. 4 out of 1,221 
 
Epistar Corporation
 patents
7. 3 out of 1,354 
 
Omnivision Technologies, Inc.
 patents
where one patent can have more than one assignee

Years Active: 2002-2025

where 'Filed Patents' based on already Granted Patents

63 patents (USPTO):
1. 12381180 - Multi-chip packages and methods of forming the same (2025-08-05),
2. 12062622 - Integrated fan-out packaging (2024-08-13),
3. 11798898 - Package structure (2023-10-24),
4. 11756928 - Multi-chip packages (2023-09-12),
5. 11437327 - Integrated fan-out packaging (2022-09-06),
6. 11342306 - Multi-chip wafer level packages (2022-05-24),
7. 11189596 - Methods of forming multi-chip wafer level packages (2021-11-30),
8. 11056445 - Package structure with buffer layer sandwiched between encapsulation layer and semiconductor substrate (2021-07-06),
9. 10867930 - Integrated fan-out packaging (2020-12-15),
10. 10797007 - Semiconductor structure and manufacturing method thereof (2020-10-06),
11. 10763239 - Multi-chip wafer level packages and methods of forming the same (2020-09-01),
12. 10529671 - Package structure and method for forming the same (2020-01-07),
13. 10269720 - Integrated fan-out packaging (2019-04-23),
14. 9899563 - Method of fabricating light-emitting diode with a micro-structure lens (2018-02-20),
15. 9899443 - Complementary metal-oxide-semiconductor (CMOS) image sensor (CIS) package with an image buffer (2018-02-20),

Title: The Innovative Journey of Hsiao-Wen Lee

Introduction: Hsiao-Wen Lee, a pioneering inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions.

Latest Patents: Lee's latest patents showcase his commitment to innovation, with a focus on cutting-edge technologies in the semiconductor industry, including advancements in nanotechnology and microelectronics.

Career Highlights: Throughout his illustrious career, Lee has been at the forefront of technological advancements, holding key positions in leading research institutions and companies. His expertise in semiconductor physics and materials science has led to the development of revolutionary products that have shaped the industry.

Collaborations: Lee's collaborative efforts with top researchers, engineers, and industry experts have been instrumental in bringing his inventions to life. His ability to work effectively in multidisciplinary teams has resulted in successful projects that have pushed the boundaries of innovation.

Conclusion: Hsiao-Wen Lee's relentless pursuit of innovation and his passion for pushing the limits of technology have established him as a trailblazer in the field of inventions. His contributions continue to inspire future generations of inventors and researchers to strive for excellence in their pursuit of groundbreaking discoveries.

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