IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11798898 B1

PDFFull Text
Date of Patent:
Oct. 24, 2023

Filed:

Jul. 02, 2021

Package structure

Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Hsiao-Wen Lee, Hsinchu, TW;

Hsien-Wen Liu, Hsinchu, TW;

Shin-Puu Jeng, Hsinchu, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Ismail A Muse

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 23/31 (2006.01); H01L 21/304 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01); H01L 21/02 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/0223 (2013.01); H01L 21/3043 (2013.01); H01L 21/48 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/56 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 21/6835 (2013.01); H01L 21/78 (2013.01); H01L 23/3135 (2013.01); H01L 23/3178 (2013.01); H01L 23/3192 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 24/18 (2013.01); H01L 21/486 (2013.01); H01L 21/568 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 23/5384 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68359 (2013.01); H01L 2221/68372 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/118 (2013.01); H01L 2224/18 (2013.01);
Abstract

Package structures are provided. A package structure includes an adhesive layer and a semiconductor substrate over the adhesive layer. The package structure also includes a connector over the semiconductor substrate. The package structure further includes a first buffer layer surrounding the connector and the semiconductor substrate and covering the adhesive layer. An interface between the adhesive layer and the first buffer layer is substantially level with a bottom surface of the semiconductor substrate. In addition, the package structure includes an encapsulation layer surrounding the first buffer layer. The package structure also includes a redistribution layer over the first buffer layer and the encapsulation layer.

Find Patent Forward Citations

Loading…