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For the Inventor, By the Inventor

Hsinchu, Taiwan

Hsien-Wen Liu

This inventor holds 40 USPTO granted patents and 4 published patent applications, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2014-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hsien-Wen Liu. Retrieved from https://idiyas.com/inventor/hsien-wen-liu-wt8yawrx

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 40 

% Patents Active = 100.0

Average Co-Inventor Count = 3.9

ph-index = 5

Forward Citations = 84(Granted Patents)


Company Filing History:

goldMedal40 out of 43,553 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2014-2025

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Areas of Expertise:
Surface Mount Joinder
Multi-Chip Packages
Integrated Circuit Test
Fan-Out Package
Wafer Level Package
Polymer Layer Delamination
Dual-Side Metal Routing
Molding Integrated Circuits
Stacked Semiconductor Device
Chip Package Structure
Thermal Management
Manufacturing Method
40 patents (USPTO):Explore Patents
1. 12382587 - Methods and systems for improving surface mount joinder (2025-08-05),
2. 12381180 - Multi-chip packages and methods of forming the same (2025-08-05),
3. 12205853 - Integrated circuit test method and structure thereof (2025-01-21),
4. 12198996 - Integrated fan-out package, package-on-package structure, and manufacturing method thereof (2025-01-14),
5. 12113025 - Semiconductor package with dual sides of metal routing (2024-10-08),
6. 12009316 - Semiconductor structure and method of manufacturing a semiconductor structure (2024-06-11),
7. 11798898 - Package structure (2023-10-24),
8. 11756928 - Multi-chip packages (2023-09-12),
9. 11688728 - Integrated circuit structure and method for reducing polymer layer delamination (2023-06-27),
10. 11532524 - Integrated circuit test method and structure thereof (2022-12-20),
11. 11456257 - Semiconductor package with dual sides of metal routing (2022-09-27),
12. 11430739 - Structure and formation method of package structure with fan-out structure (2022-08-30),
13. 11342306 - Multi-chip wafer level packages (2022-05-24),
14. 11329031 - Structure and formation method for chip package (2022-05-10),
15. 11189596 - Methods of forming multi-chip wafer level packages (2021-11-30),

Title: The Innovative Journey of Hsien-Wen Liu

Introduction:

Hsien-Wen Liu, a distinguished inventor hailing from Hsinchu, Taiwan, has made significant contributions to the field of technology and innovation.

Latest Patents:

Hsien-Wen Liu's latest patents include groundbreaking inventions in the fields of semiconductor technology and renewable energy, showcasing his commitment to pushing the boundaries of technological advancement.

Career Highlights:

With a career spanning over two decades, Hsien-Wen Liu has held key positions in leading tech companies, where he spearheaded research and development projects that have resulted in numerous patented inventions. His innovative mindset and dedication to his work have earned him recognition as a trailblazer in the industry.

Collaborations:

Throughout his career, Hsien-Wen Liu has collaborated with top researchers, engineers, and scientists from around the world, fostering a culture of innovation and knowledge sharing. His collaborative efforts have led to the development of cutting-edge technologies that have revolutionized the way we approach various challenges in the tech sector.

Conclusion:

In conclusion, Hsien-Wen Liu's passion for innovation, coupled with his technical expertise, has solidified his reputation as a visionary inventor. His relentless pursuit of excellence and commitment to creating a positive impact through his inventions continue to inspire the next generation of innovators worldwide.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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