The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2025
Filed:
Jul. 22, 2021
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Shin-Puu Jeng, Hsinchu, TW;
Hsien-Wen Liu, Hsinchu, TW;
Shih-Ting Hung, New Taipei, TW;
Yi-Jou Lin, Hsinchu, CN;
Tzu-Jui Fang, Hsinchu, CN;
Po-Yao Chuang, Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
An integrated fan-out package includes a first redistribution structure, a die, a plurality of conductive structures, an encapsulant, and a second redistribution structure. The die is bonded to the first redistribution structure through flip-chip bonding. The conductive structures surround the die. The encapsulant encapsulates the die and the conductive structures. The second redistribution structure is disposed on the encapsulant and is electrically connected to the first redistribution structure through the conductive structures. The second redistribution structure includes at least one conductive pattern layer that is in physical contact with the encapsulant. Top surfaces of the conductive structures contacting the second redistribution structure are coplanar with a top surface of the encapsulant.