Shih-Ting Hung

This inventor holds 33 USPTO granted patents and 1 published patent application, primarily in Semiconductor Packaging. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2011-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shih-Ting Hung. Retrieved from https://idiyas.com/inventor/shih-ting-hung

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 33 (Patent Applications = 1)

% Patents Active = 84.8

Average Co-Inventor Count = 5.6

ph-index = 6

Forward Citations = 3,437(Granted Patents)

Location History:

Taipei County, TW (2016)
Sanchong, TW (2011 - 2022)
New Taipei, TW (2019 - 2024)

Company Filing History:

33 out of 42,926

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2011-2025

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Areas of Expertise:

Package Structure

Surface Mount Joinder

Interposer Structure

Integrated Fan-Out Package

Manufacturing Method

Semiconductor Devices

Dielectric Punch-Through Stoppers

FinFETs

Silicon Recess Etch

Channel Epitaxial Regrowth

Chip Package Structure

Thermal Management

33 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12388028 - Package structure (2025-08-12),

2. 12382587 - Methods and systems for improving surface mount joinder (2025-08-05),

3. 12308313 - Semiconductor package with improved interposer structure (2025-05-20),

4. 12237262 - Semiconductor package with improved interposer structure (2025-02-25),

5. 12198996 - Integrated fan-out package, package-on-package structure, and manufacturing method thereof (2025-01-14),

6. 12176337 - Semiconductor devices and methods of manufacturing (2024-12-24),

7. 12051654 - Package structure and method of fabricating the same (2024-07-30),

8. 11901279 - Semiconductor package and method of manufacturing the same (2024-02-13),

9. 11901277 - Semiconductor package and method of manufacturing the same (2024-02-13),

10. 11848265 - Semiconductor package with improved interposer structure (2023-12-19),

11. 11804451 - Package structure and method of fabricating the same (2023-10-31),

12. 11637054 - Semiconductor package and method of manufacturing the same (2023-04-25),

13. 11430776 - Semiconductor devices and methods of manufacturing (2022-08-30),

14. 11430739 - Structure and formation method of package structure with fan-out structure (2022-08-30),

15. 11302650 - Package structure and method of fabricating the same (2022-04-12),

Title: The Innovative Journey of Inventor Shih-Ting Hung

Introduction: Shih-Ting Hung is a pioneering inventor hailing from Sanchong, Taiwan. His passion for innovation and dedication to creating groundbreaking solutions have made him a prominent figure in the world of patents and inventions.

Latest Patents: Shih-Ting Hung's latest patents showcase his ingenuity and forward-thinking approach to problem-solving. His recent inventions have been recognized for their unique contributions to various industries, solidifying his reputation as a prolific inventor.

Career Highlights: Throughout his illustrious career, Shih-Ting Hung has achieved numerous milestones in the field of innovation. His ability to transform ideas into tangible inventions has led to significant advancements in technology and beyond. From cutting-edge gadgets to revolutionary processes, his work has left a lasting impact on the world.

Collaborations: Shih-Ting Hung's collaborative spirit has been instrumental in his success as an inventor. By partnering with like-minded individuals and organizations, he has been able to bring his innovative concepts to life and reach new heights in the world of patents and inventions.

Conclusion: In conclusion, Shih-Ting Hung's journey as an inventor is a testament to his creativity, perseverance, and unwavering commitment to pushing the boundaries of what is possible. His contributions to the world of innovation continue to inspire and pave the way for future inventors to follow in his footsteps.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

1 patent pending: