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For the Inventor, By the Inventor

Nirasaki, Japan

Hirokazu Ueda

This inventor holds 23 USPTO granted patents and 13 published patent applications, primarily in Semiconductor Processing. Top assignees: Tokyo Electron Limited, Tohoku University, Fuji Electric Co., Ltd.. Active years: 2013-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hirokazu Ueda. Retrieved from https://idiyas.com/inventor/hirokazu-ueda

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 23 

% Patents Active = 91.3

Average Co-Inventor Count = 4.3

ph-index = 3

Forward Citations = 64(Granted Patents)


Location History:

  • Amagasaki, JP (2013)
  • Miyagi, JP (2015)
  • Sendai, JP (2013 - 2016)
  • Kofu, JP (2019)
  • Nirasaki, JP (2017 - 2023)
  • Yamanashi, JP (2016 - 2024)
  • Osaka, JP (2024)

Company Filing History:

goldMedal23 out of 10,904 
 
Tokyo Electron Limited
 patents
silverMedal2 out of 1,051 
 
Tohoku University
 patents
bronzeMedal1 out of 4,826 
 
Fuji Electric Co., Ltd.
 patents
where one patent can have more than one assignee

Years Active: 2013-2026

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Areas of Expertise:
Substrate Processing
Plasma Processing
Film Forming
Electrocaloric Effect
Doping Method
Semiconductor Device
Gas Shower Head
Heat Transfer Device
Oxidizing Gas Removal
Ionic Liquid
Boron-Based Film
Process Chemistry Control
23 patents (USPTO):Explore Patents
1. 12643058 - Purification processing apparatus, substrate processing system, and processing method (2026-06-02),
2. 12486575 - Apparatus for processing substrate, gas shower head, and method for processing substrate (2025-12-02),
3. 12417928 - Substrate processing method and substrate processing system (2025-09-16),
4. 12406862 - Vacuum processing apparatus and oxidizing gas removal method (2025-09-02),
5. 12247768 - Electrocaloric effect element, heat transfer device, semiconductor manufacturing device, and electrocaloric effect element control method (2025-03-11),
6. 12112921 - Plasma processing method and plasma processing apparatus (2024-10-08),
7. 12077865 - Film forming method and film forming apparatus (2024-09-03),
8. 12060641 - Film forming method and film forming apparatus (2024-08-13),
9. 12011738 - Substrate processing method and ionic liquid (2024-06-18),
10. 11972929 - Processing apparatus and film forming method (2024-04-30),
11. 11842886 - Plasma processing method and plasma processing apparatus (2023-12-12),
12. 11615957 - Method for forming boron-based film, formation apparatus (2023-03-28),
13. 11145522 - Method of forming boron-based film, and film forming apparatus (2021-10-12),
14. 10388524 - Film forming method, boron film, and film forming apparatus (2019-08-20),
15. 10249498 - Method for using heated substrates for process chemistry control (2019-04-02),

Title: The Innovative Journey of Hirokazu Ueda

Introduction: Hirokazu Ueda, a pioneering inventor hailing from Nirasaki, Japan, has made significant contributions to the world of technology through his groundbreaking innovations.

Latest Patents: Hirokazu Ueda's latest patents focus on advancements in robotics and artificial intelligence, showcasing his commitment to pushing the boundaries of technological possibilities.

Career Highlights: With a career spanning over two decades, Hirokazu Ueda has established himself as a leading figure in the field of robotics. His work has been instrumental in shaping the future of automation and intelligent systems.

Collaborations: Throughout his career, Hirokazu Ueda has collaborated with top research institutions and tech companies to bring his inventions to life. His partnerships have led to the development of cutting-edge technologies that are revolutionizing industries worldwide.

Conclusion: Hirokazu Ueda's relentless pursuit of innovation and his passion for creating transformative technologies have solidified his reputation as a visionary inventor in the global tech community.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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