The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 28, 2023
Filed:
Feb. 26, 2019
Applicant:
Tokyo Electron Limited, Tokyo, JP;
Inventors:
Hirokazu Ueda, Nirasaki, JP;
Jinwang Li, Nirasaki, JP;
Masahiro Oka, Nirasaki, JP;
Yoshimasa Watanabe, Nirasaki, JP;
Yuuki Yamamoto, Nirasaki, JP;
Hiroyuki Ikuta, Nirasaki, JP;
Assignee:
TOKYO ELECTRON LIMITED, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/033 (2006.01); H01L 21/02 (2006.01); C23C 16/02 (2006.01); C23C 16/28 (2006.01); C23C 16/455 (2006.01); C23C 16/50 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0332 (2013.01); C23C 16/0272 (2013.01); C23C 16/28 (2013.01); C23C 16/45536 (2013.01); C23C 16/50 (2013.01); H01L 21/0228 (2013.01); H01L 21/02274 (2013.01); H01L 21/02304 (2013.01);
Abstract
A method of forming a boron-based film mainly containing boron on a substrate includes forming, on the substrate, an adhesion layer containing an element contained in a surface of the substrate and nitrogen, and subsequently, forming the boron-based film on the adhesion layer.
Ueda, Hirokazu. (2023). Method for forming boron-based film, formation apparatus (U.S. Patent No. 11615957). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11615957
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile